Procurement Summary
State : Odisha
Summary : Thermal Effect Simulation, Qty: 1 Nos, (BOQ Item #7)
Deadline : 07 Jul 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 121065551
Document Ref. No. : GEM/2025/B/6329226
Financier : Self Financed
Purchaser Ownership : Public
Document Fees : Refer Document
Tender Value : Refer Document
EMD : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
BOQ Item Description: It should be able to model heat generation heat flow lattice heating heat sinks and effects of local temperature on physical constant
It should provide an ideal environment for design and optimization of power devices
Applications include characterization of device design thermal failure analysis and heat sink designs
This module should be capable for both 2D and 3D device simulation
BOQ Title: SILVACO TCAD OMNI University Bundle, Electromagnetic field simulation Software
Item Title: Thermal Effect Simulation
Item Quantity: 1
Unit of Measure: Nos
Delivery Period (In number of days): 30
Start Date: 17-06-2025 5:10 PM
End Date: 07-07-2025 6:00 PM
BOQ Title: SILVACO TCAD OMNI University Bundle
Documents
Tender Notice
Bid_Document_7949709.pdf
Specification_Document.pdf
BOQ_Document.csv