Procurement Summary
State : Odisha
Summary : Device simulation capability, Qty: 1 Nos, (BOQ Item #2)
Deadline : 07 Jul 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 121065547
Document Ref. No. : GEM/2025/B/6329226
Financier : Self Financed
Purchaser Ownership : Public
Document Fees : Refer Document
Tender Value : Refer Document
EMD : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
BOQ Item Description: The device simulation software should be capable of
Analyzing and characterizing the electrical optical and thermal performance of various devices in 2D and 3D
Fully integrated with process simulation software comprehensive visualization package and extensive database of examples
Material parameters and physical models for a wide range of Silicon III V III N II VI IV IV like compound semiconductor materials and polymer organic based technologies
Compatible with smartSPICE and device other simulators SPICE
BOQ Title: SILVACO TCAD OMNI University Bundle, Electromagnetic field simulation Software
Item Title: Device simulation capability
Item Quantity: 1
Unit of Measure: Nos
Delivery Period (In number of days): 30
Start Date: 17-06-2025 5:10 PM
End Date: 07-07-2025 6:00 PM
BOQ Title: SILVACO TCAD OMNI University Bundle
Documents
Tender Notice
Bid_Document_7949709.pdf
Specification_Document.pdf
BOQ_Document.csv