Corrigendum: Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,... Tender

AI AIRPORT SERVICES LIMITED has floated a tender for Corrigendum: Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets, Qty: 2 Each, (BOQ Item #6). The project location is Mumbai, Maharashtra, India. The reference number is - and it is closing on 31 Oct 2025. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Maharashtra

Summary: Corrigendum: Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets, Qty: 2 Each, (BOQ Item #6)

Deadline: 31 Oct 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 128839748

Document Ref. No.: Login to see detail

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document