Corrigendum: Dicing Blade, P/N: Hcl: Sc- 20-Q-D0-Ee Kulicke & Soffa for 725Um Wafer... Tender

SEMI-CONDUCTOR LABORATORY (SCL) has floated a tender for Corrigendum: Dicing Blade, P/N: Hcl: Sc- 20-Q-D0-Ee Kulicke & Soffa for 725Um Wafer Thickness, Qty: 25. The project location is Rupnagar, Chandigarh (UT), India. The reference number is - and it is closing on 09 Sep 2025. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Chandigarh (UT)

Summary: Corrigendum: Dicing Blade, P/N: Hcl: Sc- 20-Q-D0-Ee Kulicke & Soffa for 725Um Wafer Thickness, Qty: 25

Deadline: 09 Sep 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 125628186

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Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Documents

 Tender Notice

Bid_Document_8189834.pdf


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