Copper Grid for Tem Grid Size 300 Mesh 83 Micron Pitch 3.05 Mm Diameter, Qty: 6 100... Tender

INDIAN ARMY has floated a tender for Copper Grid for Tem Grid Size 300 Mesh 83 Micron Pitch 3.05 Mm Diameter, Qty: 6 100 grid in pack, (BOQ Item #5). The project location is Pune, Maharashtra, India. The reference number is GEM/2024/B/5015179 and it is closing on 18 Jul 2024. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Expired Tender

Procurement Summary

State : Maharashtra

Summary : Copper Grid for Tem Grid Size 300 Mesh 83 Micron Pitch 3.05 Mm Diameter, Qty: 6 100 grid in pack, (BOQ Item #5)

Deadline : 18 Jul 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 103300125

Document Ref. No. : GEM/2024/B/5015179

Financier : Self Financed

Purchaser Ownership : Public

Document Fees : Refer Document

Tender Value : Refer Document

EMD : Refer Document

Purchaser's Detail

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Tender Details

BOQ Item Description: Copper grid for TEM grid size 300 mesh 83 micron pitch 3.05 mm diameter
BOQ Title: Consumables for Electron Microscopy
Item Title: Copper Grid for Tem Grid Size 300 Mesh 83 Micron Pitch 3.05 Mm Diameter
Item Quantity: 6
Unit of Measure: 100 grid in pack
Delivery Period (In number of days): 45
Start Date: 27-06-2024 9:08 AM
End Date: 18-07-2024 10:00 AM

Documents

 Tender Notice

Bid_Document_6481005.pdf

Specification_Document.pdf

BOQ_Document.csv