Bread Board, Solder less circuit assembly, for building weather stations to check... Tender

SOFTWARE TECHNOLOGY PARKS OF INDIA (STPI) has floated a tender for Bread Board, Solder less circuit assembly, for building weather stations to check temperature and humidity., Qty: 10 Pieces, (BOQ Item #14). The project location is Kamrup, Assam, India. The reference number is - and it is closing on 31 Oct 2025. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Assam

Summary: Bread Board, Solder less circuit assembly, for building weather stations to check temperature and humidity., Qty: 10 Pieces, (BOQ Item #14)

Deadline: 31 Oct 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 127938351

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Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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