HINDUSTAN AERONAUTICS LIMITED (HAL) has floated a tender for 656-Gw0222 (Silicon Carbide Grinding Wheel (Resin Bond) Size: 125 (Dia) x 13(Thickness) x 20 Mm), Qty: 125. The project location is Koraput, Odisha, India. The reference number is - and it is closing on 15 Oct 2025.
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Procurement Summary
State: Odisha
Summary: 656-Gw0222 (Silicon Carbide Grinding Wheel (Resin Bond) Size: 125 (Dia) x 13(Thickness) x 20 Mm), Qty: 125
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