Supply of Rigid-Flex and High Density Interconnect Tender - 87868727

SPACE APPLICATIONS CENTRE (SAC) has floated a tender for Supply of Rigid-Flex and High Density Interconnect (Hdi) Printed Circuit Boards (Pcb). The project location is Ahmedabad, Gujarat, India. The reference number is SAC/APUR/SA202300008601 and it is closing on 13 Sep 2023. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Gujarat

Summary: Supply of Rigid-Flex and High Density Interconnect (Hdi) Printed Circuit Boards (Pcb)

Deadline: 13 Sep 2023

Posting Date: 26 Aug 2023

Other Information

Notice Type: Tender

TOT Ref.No.: 87868727

Document Ref. No.: SAC/APUR/SA202300008601

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Tenders are invited for Supply of Rigid-Flex and High Density Interconnect (Hdi) Printed Circuit Boards (Pcb)

Documents

Tender Notice

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Supply of Rigid-Flex and High Density Interconnect Tender - 87868727