Invitation for Industrial Conclave / Consultation to Prepare Future Road Map for... Tender

INDIA SECURITY PRESS has floated a tender for Invitation for Industrial Conclave / Consultation to Prepare Future Road Map for Next-Generation of Indian E-Passport Chip-Inlays as Per Icao Guidelines 9303 Part-13. The project location is Nashik, Maharashtra, India. The reference number is - and it is closing on 31 Dec 2025. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Maharashtra

Summary: Invitation for Industrial Conclave / Consultation to Prepare Future Road Map for Next-Generation of Indian E-Passport Chip-Inlays as Per Icao Guidelines 9303 Part-13

Deadline: 31 Dec 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 131415121

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Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Documents

Tender Notice

Invitation-for-Industrial-Conclave.pdf

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Invitation for Industrial Conclave / Consultation to Prepare Future Road Map for... Tender