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DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Globaltendercategory (Flip Chip Bonder System), Qty: 1. The project location is New Delhi, Delhi (NCT), India. The reference number is and it is closing on 07 Jul 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.
Procurement Summary
State: Delhi (NCT)
Summary: Globaltendercategory (Flip Chip Bonder System), Qty: 1
Deadline: 07 Jul 2026
Posting Date: 17 Jun 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 143430631
Document Ref. No.:
Financier: Self Financed
Purchaser Ownership: Public
Document Fees: Refer Document
Tender Value: Refer Document
EMD: Refer Document
Purchaser's Detail
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Address: Login to see tender_details
Email: Login to see tender_details
Login to see detailsTender Details
GlobalTenderCategory (Q3)
Quantity Required: 1
Start Date: 16-06-2026 2:26 PM
End Date: 07-07-2026 3:00 PM
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