Foundry Services for Fabrication of MWIR QCL, Qty Tender - 151063873

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Foundry Services for Fabrication of MWIR QCL, Qty: 460. The project location is North Delhi, Delhi (NCT), India. The reference number is GEM/2026/B/8048776 and it is closing on 29 Oct 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Expired Tender

Procurement Summary

State: Delhi (NCT)

Summary: Foundry Services for Fabrication of MWIR QCL, Qty: 460

Deadline: 29 Oct 2026

Posting Date: 16 Oct 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 151063873

Document Ref. No.: GEM/2026/B/8048776

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Plasma cleaner, Wet bench litho pre-post process, Direct writing, DRIE, PECVD, Post plasma cleaning, Wet bench 2 etching, Deposition Ti_Au or Ni_Au 10_300 nm, Wet bench 1 liftoff, Deposition AI 100nm, Deposition Ti_AI_Ni_Au stack, Rapid thermal annealing, Wafer dicer, Optical imaging

Straight Fabrication Coal Pipe (NTPC)
Quantity Required: 460

Start Date: 16-10-2026 9:46 AM

End Date: 29-10-2026 10:00 AM

BOQ Title: Foundry Services for Fabrication of MWIR QCL

Relevant Categories: Straight Fabrication Coal Pipe (NTPC)

GeMARPTS Searched: Hiring of AR/VR Services for Events, Hiring of Consultant for Energy Efficiency Services, Manpower Hiring for Financial Services, Operation And Maintenance Of Fire Fighting System
Tender ID: GEM/2026/B/8048776

Documents

 Tender Notice

Bid_Document_9906958.pdf

Specification_Document.pdf

BOQ_Document.csv

Bill of Quantities (BOQ)

# Title Description Qty Unit Delivery (Days)
1 Plasma cleaner Plasma cleaner 15 hours 360
2 Wet bench litho pre-post process Wet bench litho pre-post process 55 hours 360
3 Direct writing Direct writing 95 hours 360
4 DRIE DRIE 50 hours 360
5 PECVD PECVD 15 hours 360
6 Post plasma cleaning Post plasma cleaning 20 hours 360
7 Wet bench 2 etching Wet bench 2 etching 30 hours 360
8 Deposition Ti_Au or Ni_Au 10_300 nm Deposition Ti_Au or Ni_Au 10_300 nm 45 hours 360
9 Wet bench 1 liftoff Wet bench 1 liftoff 30 hours 360
10 Deposition AI 100nm Deposition AI 100nm 20 hours 360
11 Deposition Ti_AI_Ni_Au stack Deposition Ti_AI_Ni_Au stack 30 hours 360
12 Rapid thermal annealing Rapid thermal annealing 10 hours 360
13 Wafer dicer Wafer dicer 20 hours 360
14 Optical imaging Optical imaging 25 hours 360

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