Login
Login
Register
Complete Your Profile
Change Password
Request a Password Reset
Download Documents
Download Documents
Get Help to Participate in This Tender
Change Password
For better security, update the account password.
U R RAO SATELLITE CENTRE (URSC)/ISRO has floated a tender for For fabrication and Supply of High Density Interconnect (HDI) PCBs for space electronic packaging to URSC.. The project location is Bengaluru, Karnataka, India. The reference number is URSC/PUR/ISFA2025-0-66362/EoI/2025-26 DT: 22.01.2026 and it is closing on 22 Feb 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.
Procurement Summary
State: Karnataka
Summary: For fabrication and Supply of High Density Interconnect (HDI) PCBs for space electronic packaging to URSC.
Deadline: 22 Feb 2026
Posting Date: 23 Jan 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 134203311
Document Ref. No.: URSC/PUR/ISFA2025-0-66362/EoI/2025-26 DT: 22.01.2026
Financier: Self Financed
Purchaser Ownership: Public
Document Fees: Refer Document
Tender Value: Refer Document
EMD: Refer Document
Purchaser's Detail
Name: Login to see tender_details
Address: Login to see tender_details
Email: Login to see tender_details
Login to see detailsTender Details
For fabrication and Supply of High Density Interconnect (HDI) PCBs for space
electronic packaging to URSC.
Tender Date : Thursday, January 22, 2026 - to Sunday, February 22, 2026 - 13:00
Documents
Sign in with Google