Fabrication and Packaging of Photonic Chip Tender - 141338640

INDIAN SPACE RESEARCH ORGANISATION (ISRO) has floated a tender for Fabrication and Packaging of Photonic Chip. The project location is Ahmedabad, Gujarat, India. The reference number is SAC/EPUR/202500188901 and it is closing on 27 May 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Gujarat

Summary: Fabrication and Packaging of Photonic Chip

Deadline: 27 May 2026

Posting Date: 15 May 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 141338640

Document Ref. No.: SAC/EPUR/202500188901

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Fabrication and packaging of Photonic Chip

Category: Electrical Work/ Equipment
Organisation Chain: Indian Space Research Organisation||Space Applications Centre

Tender Category: Goods

Product Category: Electrical Work/ Equipment

Sub Category: NA

Form Of Contract: Buy

Contract Type: Tender

Bid Validity(Days): 120

Period Of Work(Days): 120

Document Download / Sale Start Date: 15-May-2026 11:25 AM

Document Download / Sale End Date: 27-May-2026 02:00 PM

Bid Submission End Date: 27-May-2026 02:00 PM

Bid Opening Date: 27-May-2026 02:15 PM

EMD Amount in ₹: 0.00

Tender Value in ₹: 0.00

Tender Fee in ₹: 0.00
Tender ID: 2026_ISRO_838175_1