Corrigendum: Thermal Compound Paste Use in Coolers Tender - 148288287

Procurement Summary

State: Maharashtra

Summary: Corrigendum: Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets, Qty: 2 Each, (BOQ Item #5)

Deadline: 01 Sep 2026

Posting Date: 01 Sep 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 148288287

Document Ref. No.: GEM/2026/B/7937132

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

BOQ Item Description: Any Brand product approved with the ISI mark

BOQ Title: Procurement of Network items, Electrical Power Connector SMA connector
BOQ Title: Procurement of Network items, Electrical Power Connector SMA connector

Item Title: Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets

Item Quantity: 2

Unit of Measure: Each

Delivery Period (In number of days): 30

Start Date: 19-08-2026 4:07 PM

End Date: 01-09-2026 5:00 PM

BOQ Title: Procurement of Network items

GeMARPTS Searched: Searched String: Lan Connectors Cardiopulmonary Bypass Connectors (V2), Substation Clamps / Connectors, Wireless LAN Access Point (V3), Terminal Strip Connectors, Connector Pipes for Washbasins/ Sinks/ Geyser, Aerial Bunched Cable For Working Voltage Upto and Including 1.1 kV Marked To IS 14255, Cir...
Tender ID: GEM/2026/B/7937132

Documents

 Tender Notice

Bid_Document_9778455.pdf

Specification_Document.pdf

BOQ_Document.csv