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Corrigendum: Globaltendercategory (Flip Chip Tender - 145018567

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Corrigendum: Globaltendercategory (Flip Chip Bonder System), Qty: 1. The project location is New Delhi, Delhi (NCT), India. The reference number is GEM/2026/B/7606951 and it is closing on 17 Jul 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Expired Tender

Procurement Summary

State: Delhi (NCT)

Summary: Corrigendum: Globaltendercategory (Flip Chip Bonder System), Qty: 1

Deadline: 17 Jul 2026

Posting Date: 12 Jul 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 145018567

Document Ref. No.: GEM/2026/B/7606951

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

GlobalTenderCategory (Q3)
Quantity Required: 1

Start Date: 16-06-2026 2:26 PM

End Date: 17-07-2026 10:00 AM
Tender ID: GEM/2026/B/7606951

Documents

 Tender Notice

Bid_Document_9404273.pdf


Corresponding Contract Award Notice

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