Corrigendum: Flip Chip Bonder, Qty: 1 Tender - 147590795

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Corrigendum: Flip Chip Bonder, Qty: 1. The project location is North Delhi, Delhi (NCT), India. The reference number is GEM/2026/B/7856531 and it is closing on 25 Aug 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Delhi (NCT)

Summary: Corrigendum: Flip Chip Bonder, Qty: 1

Deadline: 25 Aug 2026

Posting Date: 20 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 147590795

Document Ref. No.: GEM/2026/B/7856531

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Flip chip bonder

BOQ Title: Lea Symbol Low Contrast 10M Flip chart
Quantity Required: 1

Start Date: 31-07-2026 4:01 PM

End Date: 25-08-2026 10:00 AM

GeMARPTS Searched: Nail Chip, Lea Symbol Low Contrast 10M Flip chart, Smart Card (Scosta / Scosta - CL), Chips, Banana Chips from Kamrup - ODOP, Basic/Feature Mobile Phone, Rotary Hammer / Chipping and Demolition Hammers (V3), Drone and IoT Forensic Analysis Software, Particle Boards, Potato Products from Rupnagar - O...
Tender ID: GEM/2026/B/7856531

Documents

Tender Notice

Bid_Document_9686208.pdf

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Corresponding Contract Award Notice