Corrigendum: Die Bonder and Wedge and Ball Bonder Tender - 151849442

INDIAN INSTITUTE OF TECHNOLOGY (IIT) has floated a tender for Corrigendum: Die Bonder and Wedge and Ball Bonder, Qty: 1. The project location is Gandhi Nagar, Gujarat, India. The reference number is GEM/2026/B/8097318 and it is closing on 05 Nov 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Gujarat

Summary: Corrigendum: Die Bonder and Wedge and Ball Bonder, Qty: 1

Deadline: 05 Nov 2026

Posting Date: 02 Nov 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 151849442

Document Ref. No.: GEM/2026/B/8097318

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: ₹ 168000

Purchaser's Detail

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Tender Details

Die Bonder and Wedge and Ball Bonder

Silicon Carbide (SiC) as per SAIL specifications

Plastic Cricket Set (Preschool Kit) (V2), Softening Point Test Apparatus (Ring and Ball Apparatus), Moulds for Use in Tests of Cement, Concrete and Pozzolana Conforming to IS 10086, Health Supplements, Nutraceuticals and Food for Special Dietary Use (V2), Storage Box for Electronic Component, Wood P...
Quantity Required: 1

Start Date: 29-09-2026 6:25 PM

End Date: 05-11-2026 7:00 PM

EMD Amount: 168000

Relevant Categories: Silicon Carbide (SiC) as per SAIL specifications

GeMARPTS Searched: Plastic Cricket Set (Preschool Kit) (V2), Softening Point Test Apparatus (Ring and Ball Apparatus), Moulds for Use in Tests of Cement, Concrete and Pozzolana Conforming to IS 10086, Health Supplements, Nutraceuticals and Food for Special Dietary Use (V2), Storage Box for Electronic Component, Wood P...
Tender ID: GEM/2026/B/8097318

Documents

Tender Notice

Bid_Document_9962585.pdf

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Corresponding Contract Award Notice