Corrigendum: Customized Semiconductor Wafer Bonder Tender - 148023701

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Corrigendum: Customized Semiconductor Wafer Bonder Setup, Optical Inspection Unit with Universal Zoom Head and Ti, Qty: 2. The project location is North Delhi, Delhi (NCT), India. The reference number is GEM/2026/B/7839477 and it is closing on 28 Aug 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Delhi (NCT)

Summary: Corrigendum: Customized Semiconductor Wafer Bonder Setup, Optical Inspection Unit with Universal Zoom Head and Ti, Qty: 2

Deadline: 28 Aug 2026

Posting Date: 27 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 148023701

Document Ref. No.: GEM/2026/B/7839477

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Customized Semiconductor Wafer Bonder Setup, Optical Inspection Unit With Universal Zoom Head And Tilting Frame

BOQ Title: Discrete Semiconductor Devices (Active
Quantity Required: 2

Start Date: 28-07-2026 11:33 AM

End Date: 28-08-2026 4:00 PM
Tender ID: GEM/2026/B/7839477

Documents

Tender Notice

Bid_Document_9666993.pdf

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Corresponding Contract Award Notice