Corrigendum: Automatic Wafer Dicing Machine Tender - 133010320

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Corrigendum: Automatic Wafer Dicing Machine. The project location is North Delhi, Delhi (NCT), India. The reference number is SPL/GEM/BU/C/24-25/277 and it is closing on 21 Jan 2026. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Procurement Summary

State: Delhi (NCT)

Summary: Corrigendum: Automatic Wafer Dicing Machine

Deadline: 21 Jan 2026

Posting Date: 02 Jan 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 133010320

Document Ref. No.: SPL/GEM/BU/C/24-25/277

Financier: Self Financed

Purchaser Ownership: Public

Document Fees: Refer Document

Tender Value: Refer Document

EMD: Refer Document

Purchaser's Detail

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Tender Details

Automatic Wafer Dicing Machine
Category: Miscellaneous Goods
Organisation Chain: Department of Defence Research and Development||Defence Research and Development Organisation||DFMM||Office of DG (MED and COS)||SSPL
Tender Category: Goods
Product Category: Miscellaneous Goods
Sub Category: NA
Form Of Contract: Supply
Contract Type: Tender
Bid Validity(Days): 180
Period Of Work(Days): 120
Document Download / Sale Start Date: 04-Dec-2025 05:30 PM
Document Download / Sale End Date: 21-Jan-2026 02:00 PM
Bid Submission End Date: 21-Jan-2026 02:00 PM
Bid Opening Date: 22-Jan-2026 02:30 PM
Tender Value in ₹: NA

Tender ID: 2025_DRDO_742704_1

Documents

Tender Notice

Tendernotice_1.pdf

work_item_documents.zip

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Corresponding Contract Award Notice