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Home » Search RFP » Latest Global Chip Module Encapsulation RFP & RFQ

Latest Global Chip Module Encapsulation RFP & RFQ

Supply and Installation of Laser Lithography Equipment and Encapsulated Multi-Chip Modules for the Advanced Encapsulated Prototype Line, Intended for the Microele Institute ...

Deadline: 30 Jun 2025

Spain

Deadline: 30 Jun 2025

TOT Reference No.: 120042788

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Production and Supply of Starcos 3.74 Eidas C3 Dual Chip Modules and Pre-Laminates with Antenna

Deadline: 22 Jul 2024

Czech Republic

Deadline: 22 Jul 2024

TOT Reference No.: 103110553

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Production and Supply of Starcos 3.74 Eidas C3 Dual Chip Modules and Pre-Laminates with Antenna

Deadline: 18 Jul 2024

Czech Republic

Deadline: 18 Jul 2024

TOT Reference No.: 102887302

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Production and Supply of Starcos 3.7 Eidas C1 Chip Modules

Deadline: 22 Mar 2024

Czech Republic

Deadline: 22 Mar 2024

TOT Reference No.: 98735899

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Production and Delivery of Chip Modules Starcos 3.7 Eidas C1

Deadline: 15 Mar 2024

Czech Republic

Deadline: 15 Mar 2024

TOT Reference No.: 96904689

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