Global Optoelectronic Tenders and GPN from across the Globe

Public Tender Announcement for the Vacuum Pressure Hot Pressing Sintering Bonding System Procurement Project (Second) of the School of Precision Instruments and Optoelectronics Engineering of Tianjin University

Public Tender Announcement for the Precision Automatic Grinding Wheel Cutting Machine Procurement Project (Second) of the School of Precision Instruments and Optoelectronics Engineering of Tianjin University

Beijing Information Optoelectronic Chip Platform Construction Project

Beijing Information Optoelectronic Chip Platform Construction Project

Beijing Information Optoelectronic Chip Platform Construction Project

Beijing Information Optoelectronic Chip Platform Construction Project

Array Exposure of Mianyang Hkc Optoelectronics

Chuzhou Hkc Optoelectronics Technology Co., Ltd. Module Side Sealing Dispenser

Electron Beam Evaporation Procurement Project of the School of Precision Instruments and Optoelectronic Engineering, Tianjin University

Announcement on Competitive Consultation for the Construction of Intelligent Optoelectronic Device Laboratory (Integrated Design-Construction)