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Global Chip Module Implanting Tenders and GPN from across the Globe

TendersOnTime provides latest updates on Global Chip Module Implanting Tenders, Contract Awards and various other opportunities related to Chip Module Implanting. The information on Chip Module Implanting tenders is collected from various sources viz: government tenders portal, tender bulletin and public procurement websites.

Milling and Implanting System of Contact Chip Modules and Fingerprintsensors for Id1 Cards // Embedding System of Contact Chip Modules and Fingerprint Sensors for Id1 Cards

Deadline: 23 Feb 2024

Czech Republic

Deadline: 23 Feb 2024

TOT Reference No.: 95591062

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