Global Chip Module Encoding Tenders and GPN from across the Globe

Production and Delivery of Starcos 3.7 Eidas C2 Dual Interface Chip Modules and Inlays with Antenna

-In Contactless Chip Module and Transport Attachment)

Item Number 22, Qty: 1 Each, (BOQ Item #22)

Chips Microwave Impedance Microscopy Module for Quantitative Assessment of Defects

with a Non-Contact Encoder and a Double Lamination Module, and a Data Capture Workstation

Two (2) Units Smart Tablets Device

Milling and Implanting System of Contact Chip Modules and Fingerprintsensors for Id1 Cards

Production and Delivery of Chip Modules Starcos 3.7 Eidas C1

Production and Supply of Starcos 3.7 Eidas C1 Chip Modules

A Student Ticket Card with a Built-In Contactless Chip Module and a Transport Application