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European Chip Inductor for Point of Load Tender - 100900810

The EUROPEAN SPACE RESEARCH AND TECHNOLOGY CENTRE (ESTEC) has issued a Tender notice for the procurement of a European Chip Inductor for Point of Load Converters in Telecommunication Satellites (Artes 4.0 at 5c.499) in the Netherlands. This Tender notice was published on 07 May 2024 and is scheduled to close on 06 Sep 2024, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 100900810, while the tender notice number is 1-11727 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Netherlands

Summary: European Chip Inductor for Point of Load Converters in Telecommunication Satellites (Artes 4.0 at 5c.499)

Deadline: 06 Sep 2024

Posting Date: 07 May 2024

Other Information

Notice Type: Tender

TOT Ref.No.: 100900810

Document Ref. No.: 1-11727

Competition: ICB

Financier: Agency for the Cooperation of Energy Regulators (ACER)

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

Tenders are invited for European Chip Inductor for Point of Load Converters in Telecommunication Satellites (Artes 4.0 at 5c.499)
The objective of the activity is to design, manufacture and test surface mount chip inductors enabling low voltage (down to 0.8 V range) stability, fast transient response, high-speed switching capability and efficient power conversion of point of load(POL) converters, as needed for next generation digital integrated circuits in telecommunication satellites.Targeted Improvements:- Enablinga European source.- 20% mass and volume reduction and 20% increase in the inductor s maximum saturation current, both with respectto current solutions.Description:Point of load converters (POLs) are essential elements in the distributed power architecture oftelecommunication satellites. They allow for an efficient DC powering of electric components, such as NG-ULTRA 28 nm FPGAs. Today POLsare widely used, however they cannot meet the low voltage stability, fast transient response, high-speed switching capability and efficient power conversion requirements, in particular for next generation FPGA devices (e.g., 7 nm ULTRA7).This activity will develop a high current, surface-mountable chip inductor technology that will allow for the high integration needed to meet the power supply requirements of next generation digital integrated circuits. The chip inductor technology will allow an improvement in the saturation current of at least 20%, up to several tens of amperes, as compared to currently available solutions. Part of the activity is the development of a complimentary manufacturing process and packaging technology to achieve overall a reduction of 20% in the mass and volume of the inductor in comparison to the state of the art today. The use of additive manufacturing for the inductor core basedon polymers with magnetic nano particles shall be investigated. A surface mounted inductor will be designed, manufactured and experimentally tested.Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional informationplease go to:http://www.esa.int/About_Us/Business_with_ESA/Small_and_Medium_Sized_Enterprises/Opportunities_for_SMEs/Procurement_policy_on_fair_access_for_SMEs_-_the_C1-C4_Clauses

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