Wirebonder Tender in Germany - 138541657

Procurement Summary

Country: Germany

Summary: Wirebonder

Deadline: 15 Apr 2026

Posting Date: 27 Mar 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 138541657

Document Ref. No.: N-ÖA/2026-68

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

For the construction and contacting of Photonic Integrated Circuits (PIC) on TFLN/lithium niobate, the Friedrich Schiller University Jena would like to procure one (1) semi-automatic wire bonder with wedge and ball bonding for aluminum and gold wires. goal is the creation of defined bond loops on dense pad fields and stable high-frequency/direct current contacts. Typical pad sizes are 100 x 100 μm. It thus closes the gap between die bonding and electrical/optical characterization for Laboratory and pilot line production. These technical performance parameters according to Annex 2 must at least be met. Main part (1): Laboratory equipment, optical equipment and precision equipment (except glasses) (38000000-5)
Type of procedure: Friedrich Schiller University Jena, Institute of Applied Physics, Albert-Einstein-Str. 6, 07745 Jena

Documents

 Tender Notice