Waferbond_Plant - Pr478860-2660-W Tender in Germany - 94743210

Procurement Summary

Country: Germany

Summary: Waferbond_Plant - Pr478860-2660-W

Deadline: 19 Jan 2024

Posting Date: 05 Jan 2024

Other Information

Notice Type: Tender

TOT Ref.No.: 94743210

Document Ref. No.: 761868-2023

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

42641000 - Machine tools for working stone, ceramics, concrete or glass

Purchaser's Detail

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Tender Details

Waferbond_System
Waferbond_System - PR478860-2660-W
1 piece Waferbond_System with options:
18.2 Alignment method: With registration marks
19.3 10 kN, on the entire substrate surface
20.2.1 One or optionally two substrates can be coated in one coating step.
20.5 The possibility ofto deposit their materials as silicon. Possible materials must be specified.
22.3 A quartz glass wafer to be bonded to a quartz glass wafer
28.1 The machine must be equipped with devices for handling wafers with a nominal diameter of 100 mm. The one availablen Device sizes must be specified.
31.2 Stack height in bonded state up to 30 mm
35. Software updates for at least 3 years at a separate price.
36. An annual maintenance contract for at least 2 years must be offered separately. The service must have an overall inspectionion of the device with particular attention to all safety-relevant components and functions include
Doc Title: Waferbond_anlage - PR478860-2660-W
Contract Type: supplies
Document Type: Contract Notice

Reference Number: PR478860-2660-W

Contract Type: supplies

Authority Type: pub-undert

Doc Title: Waferbond_Anlage - PR478860-2660-W

Dispatch Date: 2023-12-14

Publish Date: 2023-12-15

Submission Date: 2024-01-19

Documents

 Tender Notice