Wafer Saw Tender in Germany - 136993201

Procurement Summary

Country: Germany

Summary: Wafer Saw

Deadline: 02 Apr 2026

Posting Date: 03 Mar 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 136993201

Document Ref. No.: 25-178

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

Name: Login to see tender_details

Address: Login to see tender_details

Email: Login to see tender_details

Login to see details

Tender Details

The Institute of Semiconductor Optics and Functional Interfaces (IHFG) has developed InAs quantum dot (QD) structures that emit in the C-band of the telecommunications sector and on metamorphic buffer layers (MMBs) made of InGaAs on a GaAs platform based. The growth of these QD structures is currently optimized for small substrates (15 × 15 mm2 samples), but efforts are underway to scale it to full 4-inch wafers. The IHFG wants to increase the intrinsic growth gradient across wafers to develop photonic cavities (particularly bullseye cavities) that operate at different wavelengths for different quantum applications. In such a case, the fabrication of the bullseye cavity would require only a single one require an epitaxy growth step, followed by wafer bonding to a silicon carrier wafer, membrane processing, and high-precision dicing to produce numerous chips covering a range of cavity wavelengths. In addition, for the fabrication of waveguides in which telecom QDs are embedded, the facets of the waveguides must be prepared using a ductile cutting process to achieve optically smooth surfaces suitable for a efficient light coupling are suitable. For the integration of the QD membrane into silicon-based photonic integrated platforms to realize III-V/Si-based quantum photonic integrated circuits (QPICs), the integrated circuit must be on Siliziumbasis geschnitten werden. A high-precision cutting saw is essential for all of the applications mentioned. Laboratory, optical and precision equipment (excl. glasses) (CPV code: 38000000)

Documents

 Tender Notice