Semi-Automated Wafer Prober - Pr879710-2390-P Tender, Germany - 114375916

Procurement Summary

Country : Germany

Summary : Semi-Automated Wafer Prober - Pr879710-2390-P

Deadline : 10 Mar 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 114375916

Document Ref. No. : 84579-2025

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

1 Piece semi-automated wafer prober As part of a project, Fraunhofer ISIT is planning to procure a semi-automatic wafer prober. The qualification of chiplet function throughout the processing and their packaging is steady effort. Current setups are limited in the handling of thin wafers (below 300µm) and to capture the increasingly complex characteristics of next gen. chiplets. This waferprober is rated to be compatible with wafer thicknesses down to 50µm and samples sizes from die to 200mm wafers and can support automatic in-die stepping. The chiplets to be characterized cover the application areas from ultra-low-power memory, ultra-high-power conversion, Piezo-/ferroelectric MEMS and in most generic terms increasingly fast switching capabilities. These require precise current and voltage measurement - also at the chuck - below 1µs at voltages and currents in the ranges of up to 1000V and 100A, respectively, to capture the wide application range.

Doc Title: semi-automated wafer prober - PR879710-2390-P

Contract Type: supplies
Document Type: Contract Notice
Reference Number: PR879710-2390-P
Contract Type: supplies
Authority Type: pub-undert
Doc Title: semi-automated wafer prober - PR879710-2390-P
Dispatch Date: 2025-02-06
Publish Date: 2025-02-07
Submission Date: 2025-03-10

Documents

 Tender Notice