Procurement Summary
Country : Germany
Summary : Pvd-Sputter-Cluster for Dielectric Materials - Pr887139-2380-P
Deadline : 03 Jun 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 119013005
Document Ref. No. : 301819-2025
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
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Introduction Quasi-monolithic integrated (QMI) chiplets combining manifold functions like microprocessors, signal processing high speed interfaces and integrated sensor demand for high quality optical layers. For a quasi-monolithic backend integration of optical chiplets such as photodetectors, lasers, filters, phase shifters or couplers, a large variety of dielectric films (such as SiO2, TiO2, Si3N4 or AlN) is needed to match all requirements of the final chiplet technology. To achieve good overall performance of the chiplet, a very high purity of the film material as well as a good uniformity of the deposited film is required. The deposition of these films shall be done by physical vapor deposition (PVD) sputtering in a cluster system for 200 mm wafers. The configuration of the system allows at least the deposition of the oxides and nitrides from Aluminium, Silicon and Titanium in dedicated chamber modules which is essential for the QMI processing line. The thicknesses of the deposited films range from a few nm to 1 µm. The desired uniformity of thickness and optical properties of the deposited dielectric films should, as far as possible, not exceed 3%. For advanced applications the system requires a R&D chamber for the deposition of transparent conductors or piezoelectrica. These materials are needed to extend the functionality of the future chiplet backend integration. Avoiding cross-contamination and impurities is crucial for the quality of the optical properties of the ...
Document Type: Contract Notice
Reference Number: PR887139-2380-P
Contract Type: supplies
Authority Type: pub-undert
Doc Title: PVD-Sputter-Cluster for dielectric materials - PR887139-2380-P
Dispatch Date: 2025-05-12
Publish Date: 2025-05-13
Submission Date: 2025-06-03
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Tender Notice