Purchase of a Drie/Rie System (Plasma Etching Tender - 142712175

Procurement Summary

Country: Germany

Summary: Purchase of a Drie/Rie System (Plasma Etching System)

Deadline: 10 Jul 2026

Posting Date: 05 Jun 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 142712175

Document Ref. No.: 388383-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)
42990000 - Miscellaneous special-purpose machinery
31712330 - Semiconductors

Purchaser's Detail

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Tender Details

Purchase of a DRIE/RIE system (plasma etching system) Short description: Purchase of a new DRIE/RIE system (plasma etching system) - with software and system control including installation and instruction Consisting of: DRIE/RIE system, substrate electrode, Edge protection of the wafers during etching, notching control/reduction of structural deviation when etching stops on dielectrics, end point detection, software and system control, packaging/transport/unloading/insertion/installation included Commissioning and training Description of the procurement (type and scope of the service or statement of needs and requirements) New DRIE/RIE system including accessories for research at the WHZ with the following requirements: 01 1 RIE/DRIE system Plasma etching system for plasma-chemical, reactive silicon deep etching (?500µm) using the Bosch process (gas chopping process) and RIE of thin dielectric layers (?2µm). - The system must be able to process 100mm wafers with and without primary flat, as well as with and without secondary flat rate. - The system must allow the processing of 150mm wafers with and without primary flat, with and without secondary flat or with and without notch. - The silicon removal volume possible per unit of time in DRIE mode is up to approx. 2.5 mm3/s, the thermal management must be designed accordingly. The exact process parameters to be met can be found in the specification table in the section "Required process parameters and their verification...
Document Type: Contract Notice Reference Number: OV 09-26 Contract Type: supplies Authority Type: body-pl-ra Doc Title: Purchase of a DRIE/RIE system (plasma etching system) Dispatch Date: 2026-06-04 Publish Date: 2026-06-05 Submission Date: 2026-07-10

Documents

 Tender Notice