Prior Information Notice - Wafer Thinning Procurement Plan/GPN/PIN - 143085887

Procurement Summary

Country: Germany

Summary: Prior Information Notice - Wafer Thinning Equipment

Deadline: 26 Jul 2026

Posting Date: 11 Jun 2026

Other Information

Notice Type: Procurement Plan/GPN/PIN

TOT Ref.No.: 143085887

Document Ref. No.: 400725-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 250000

CPV Classification

42990000 - Miscellaneous special-purpose machinery

Purchaser's Detail

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Tender Details

Prior Information Notice - Wafer Thinning Equipment The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipment is intended to enable precise thickness control and process monitoring, including in-situ measurement capabilities. It will be installed in a cleanroom environment and must be compatible with ISO class 5 requirements. The procurement procedure is planned for 2026. Doc Title: Prior Information Notice - Wafer Thinning Equipment Contract Type: supplies
Document Type: Prior Information Notice Reference Number: FBJ-04.2.1 Thinning Equipment Contract Type: supplies Estimated Value: 250000 - EUR Authority Type: la Doc Title: Prior Information Notice – Wafer Thinning Equipment Dispatch Date: 2026-06-10 Publish Date: 2026-06-11 Submission Date: 2026-07-26

Documents

 Tender Notice