Prior Information Notice - Wafer Dicing Equipment Procurement Plan/GPN/PIN - 143095720

Procurement Summary

Country: Germany

Summary: Prior Information Notice - Wafer Dicing Equipment

Deadline: 26 Jul 2026

Posting Date: 11 Jun 2026

Other Information

Notice Type: Procurement Plan/GPN/PIN

TOT Ref.No.: 143095720

Document Ref. No.: 401281-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 275000

CPV Classification

42990000 - Miscellaneous special-purpose machinery

Purchaser's Detail

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Tender Details

Prior Information Notice - Wafer Dicing Equipment The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026. Doc Title: Prior Information Notice - Wafer Dicing Equipment Contract Type: supplies
Document Type: Prior Information Notice Reference Number: FBH-04.2.3 Dicing Equipment Contract Type: supplies Estimated Value: 275000 - EUR Authority Type: la Doc Title: Prior Information Notice – Wafer Dicing Equipment Dispatch Date: 2026-06-10 Publish Date: 2026-06-11 Submission Date: 2026-07-26

Documents

 Tender Notice