Prior Information Notice - Laser Manufacturing Procurement Plan/GPN/PIN - 143086314

Procurement Summary

Country: Germany

Summary: Prior Information Notice - Laser Manufacturing System for Wafer Processing

Deadline: 26 Jul 2026

Posting Date: 11 Jun 2026

Other Information

Notice Type: Procurement Plan/GPN/PIN

TOT Ref.No.: 143086314

Document Ref. No.: 400758-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 1292000

CPV Classification

42990000 - Miscellaneous special-purpose machinery

Purchaser's Detail

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Tender Details

Prior Information Notice - Laser Manufacturing System for Wafer Processing The Ferdinand-Braun-Institut (FBH) plans to procure a laser-based manufacturing system for advanced wafer processing within the framework of the EU-funded APECS programme. The system will be used for various opto-mechanical processing steps, including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. It shall be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm. The equipment is intended to significantly expand the institute-s capabilities in high-precision wafer processing. It will be installed in a cleanroom environment and must comply with ISO class 5 requirements, including laser protection class 1. The procurement procedure is planned for 2026 The Ferdinand-Braun-Institut (FBH) plans to procure a laser-based manufacturing system for advanced wafer processing within the framework of the EU-funded APECS programme. The system will be used for various opto-mechanical processing steps, including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. It shall be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm. The equipment is intended to significantly expand the institute-s capabilities in high-precision ...
Document Type: Prior Information Notice Reference Number: FBH‑04.3 (Laser Manufacturing System) Contract Type: supplies Estimated Value: 1292000 - EUR Authority Type: la Doc Title: Prior Information Notice – Laser Manufacturing System for Wafer Processing Dispatch Date: 2026-06-10 Publish Date: 2026-06-11 Submission Date: 2026-07-26

Documents

 Tender Notice