Prior Information Notice - Eddy Current Wafer Procurement Plan/GPN/PIN - 143170795

Procurement Summary

Country: Germany

Summary: Prior Information Notice - Eddy Current Wafer Mapping System

Deadline: 27 Jul 2026

Posting Date: 12 Jun 2026

Other Information

Notice Type: Procurement Plan/GPN/PIN

TOT Ref.No.: 143170795

Document Ref. No.: 404299-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 248000

CPV Classification

42990000 - Miscellaneous special-purpose machinery

Purchaser's Detail

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Tender Details

Prior Information Notice - Eddy Current Wafer Mapping System The Ferdinand-Braun-Institut (FBH) plans to procure an eddy current wafer mapping system within the framework of the EU-funded APECS programme. The system will be used for non-destructive electrical characterisation of semiconductor wafers during processing, including sheet resistance and conductivity measurements. It is intended to support process monitoring and quality control in advanced semiconductor manufacturing. The equipment shall enable automated, high-resolution mapping of wafers up to 200 mm in diameter and provide fast feedback on process uniformity and material properties. It will be installed in a cleanroom environment and integrated into existing process workflows. The procurement procedure is planned for 2026. Doc Title: Prior Information Notice - Eddy Current Wafer Mapping System Contract Type: supplies
Document Type: Prior Information Notice Reference Number: FBH‑06.3.3 (Eddy Current Wafer Mapper) Contract Type: supplies Estimated Value: 248000 - EUR Authority Type: la Doc Title: Prior Information Notice – Eddy Current Wafer Mapping System Dispatch Date: 2026-06-10 Publish Date: 2026-06-12 Submission Date: 2026-07-27

Documents

 Tender Notice