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MARION COUNTY has floated a tender for Itb - Aggregate for Chip Seals for the 2026 Marion County Chip Seal Program. The project location is USA and the tender is closing on 22 Jan 2026. The tender notice number is S-C25102-00015668, while the TOT Ref Number is 133283554. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country: USA
Summary: Itb - Aggregate for Chip Seals for the 2026 Marion County Chip Seal Program
Deadline: 22 Jan 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 133283554
Document Ref. No.: S-C25102-00015668
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Bulletin Desc : Invitation to Bid for the procurement of chip seal aggregate for the 2026 Marion County Chip Seal Program supply and delivery to storage facility.
Bid Number: : S-C25102-00015668
Bid Opening Date : 01/22/2026 02:00:00 PM
Location : C2510 - Public Works
Bid Type : OPEN
Documents
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