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The MARION COUNTY has issued a Tender notice for the procurement of a Itb - Aggregate for Chip Seals for the 2026 Marion County Chip Seal Program in the USA. This Tender notice was published on 08 Jan 2026 and is scheduled to close on 22 Jan 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 133283554, while the tender notice number is S-C25102-00015668 and Registering on the platform.
Procurement Summary
Country: USA
Summary: Itb - Aggregate for Chip Seals for the 2026 Marion County Chip Seal Program
Deadline: 22 Jan 2026
Posting Date: 08 Jan 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 133283554
Document Ref. No.: S-C25102-00015668
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Bulletin Desc : Invitation to Bid for the procurement of chip seal aggregate for the 2026 Marion County Chip Seal Program supply and delivery to storage facility.
Bid Number: : S-C25102-00015668
Bid Opening Date : 01/22/2026 02:00:00 PM
Location : C2510 - Public Works
Bid Type : OPEN
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