Deposition Tool 8 Inch Tender in Germany - 147695519

Procurement Summary

Country: Germany

Summary: Deposition Tool 8 Inch

Deadline: 05 Oct 2026

Posting Date: 21 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 147695519

Document Ref. No.: 579224-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)
42900000 - Miscellaneous general and special-purpose machinery

Purchaser's Detail

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Tender Details

Deposition Tool 8 Inch The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping). siehe Leistungsbeschreibung. Doc Title: Deposition Tool 8 Inch Contract Type: supplies
Document Type: Contract Notice Reference Number: TUM-E23-2026-01 Contract Type: supplies Authority Type: body-pl-ra Doc Title: Deposition Tool 8 Inch Dispatch Date: 2026-08-20 Publish Date: 2026-08-21 Submission Date: 2026-10-05

Documents

 Tender Notice