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Contract notice: Laboratory, optical and precision Tender - 34588886

The IHP GMBH - LEIBNIZ-INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK has issued a Tender notice for the procurement of a Contract notice: Laboratory, optical and precision equipments (excl. glasses) in the Germany. This Tender notice was published on 11 Jul 2019 and is scheduled to close on 15 Aug 2019, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 34588886, while the tender notice number is 323727-2019 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Germany

Summary: Contract notice: Laboratory, optical and precision equipments (excl. glasses)

Deadline: 15 Aug 2019

Posting Date: 11 Jul 2019

Other Information

Notice Type: Tender

TOT Ref.No.: 34588886

Document Ref. No.: 323727-2019

Competition: ICB

Financier: Self Financed

Purchaser Ownership: -

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Object of the contract
Laboratory, optical and precision equipments (excl. glasses)
Description: Contract notice: Laboratory, optical and precision equipments (excl. glasses)
Authority Type: Other
Contact Nature: Supplies
Procedure: Open procedure
Document: Contract notice
Regulation: European Union
Award criteria: The most economic tender
CPV code: 38000000, 38000000, 38000000
CPV Description: Laboratory, optical and precision equipments (excluding glasses).
Grinder and Edgetrimmer
Reference Number: IHP-2019-069
Specifications for: Grinder and Edgetrimmer for 200 mm BiCMOS wafers and temporary / permanent bonded wafer stacks with the equipment The 200mm pilot line for temporary and permanent wafer bonding will be expanded to include process quality and -stability to increase throughput in grind- ing and ed trimming, as well as creating new process capabilities for processing 200 mm SiGe BiCMOS wafers and temporary / permanent bonded wafer stacks. The processes developed at the IHP with the existing equipment should be transferable to the new plants. For the extension of the Waferbonding pilot line different PrEssentials:
Main Site: IHP GmbH Leibniz Institute for Innovative Microelectronics
Grinder.
- Certification in Tax Matters:
The AG reserves itself before placing the order, a request with the responsible anti-corruption register as well as at the commercial central registration office.
You can find the tender documents on the awardmarktplatz Brandenburg
http://vergabemarktplatz.brandenburg.de You can register yourself voluntarily on the awarding platform "Vergabemarktplatz Brandenburg" and download the tender documents there. This offers you the advantage that you automatically receive changes in the tender documents or answers to questions to the tendering procedure.
Register nNot, there is a corresponding debt, that is, you have to inform yourself, whether the procurement documents have been changed in the meantime and if we have answered bidder questions on the award process.
Please note that to ask a question about the procedure and for delivering a Offer and, if in the concrete procedure, relevant for the submissionregistration of the application or for the submission of an interest confirmation anyway.
The participation documents and the offer documents must be scannable and should not be bound or cloned.
Announcement ID: CXSTYYDYY3E
Internet address (URL): https://www.ihp-microelectronics.com/en/start.html

Documents

 Tender Notice


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