Cmp Table Device Tender in Germany - 124784653

Procurement Summary

Country: Germany

Summary: Cmp Table Device

Deadline: 25 Sep 2025

Posting Date: 20 Aug 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 124784653

Document Ref. No.: NLB2025_08

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

The intended procurement includes the delivery, installation and commissioning of a new, non-used chemical-mechanical polishing device (table CMP device), which for combined chemical-mechanical planarization of both metallic and dielectric layers or Films should be used. The metallic and dielectric layers to be planned are usually separated into structures with physical or chemical methods, which have been structured or processed using photolithographic methods and dry chemical processes. The table CMP device should be able to polish wafer sample pieces of sizes 2x2 cm2, 4x4 cm2 and wafer with a diameter of up to 100 mm chemical-mechanically. The tool is to be installed and operated on a table in a clean room of ISO class 5 (DIN EN ISO 14644-1) and compatible with the Be clean room class. This area is regulated temperature and air humidity. The disposal of the used polishing agents should be possible through a disposal line and a barrel recording.

Microelectronic Machinery and Apparatus (CPV code: 31712100)

CMP table Device

Documents

 Tender Notice