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Beol Layer Transfer, Fully Automated (Izm-135) Tender - 130965429

The FRAUNHOFER-GESELLSCHAFT - EINKAUF B12 has issued a Tender notice for the procurement of a Beol Layer Transfer, Fully Automated (Izm-135) - Pr1108543-3460-P in the Germany. This Tender notice was published on 27 Nov 2025 and is scheduled to close on 07 Jan 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 130965429, while the tender notice number is 788026-2025 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Germany

Summary: Beol Layer Transfer, Fully Automated (Izm-135) - Pr1108543-3460-P

Deadline: 07 Jan 2026

Posting Date: 27 Nov 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 130965429

Document Ref. No.: 788026-2025

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

31712100 - Microelectronic machinery and apparatus

Purchaser's Detail

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Tender Details

1x BEoL Layer Transfer, fully automated To meet the strong demand for a reliable processing and handling of semiconductor wafers with thicknesses down to below 20 µm, the temporary bonding of device wafers on thick carrier wafers is a well-established approach. Common temporary carrier systems are glass wafers in combination with polymer-based adhesion layers. In case of glass-carriers, for the final wafer debond the temporary bond layers can be manipulated via UV-laser to lower the bond strength. The aim of the machine specified here, is to perform the debonding via infrared (IR) light-based laser, so that silicon-wafers can be used as temporary carriers. The purpose of this equipment specification is to define basic requirements for a Fully automatic IR-Laser Debonder for the debonding of, among others, • silicon wafers and wafers of other types of materials • device wafers of down to below 20 µm thickness • inorganic RDL-first and Back-End-of-Line (BEoL) layers temporarily bonded and assembled on different sorts of Si carrier wafers using different bond layers. The temporarily bonded wafer pairs will be mounted on film frames, so that they are delivered to the laser debonder in standardized film frame cassettes. The debonding system must be able to run fully-automatically the following series of steps. • Loading of film frame from film frame cassette • Mechnical pre-alignment and wafer ID-reading • Handling of film frame into laser debonding station • Laser treatment • Un...
Document Type: Contract Notice

Reference Number: PR1108543-3460-P

Contract Type: supplies

Authority Type: pub-undert

Doc Title: BEoL Layer Transfer, fully automated (IZM-135) - PR1108543-3460-P

Dispatch Date: 2025-11-26

Publish Date: 2025-11-27

Submission Date: 2026-01-07

Documents

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