200 Mm Wafer Prober Incl. Temperature Testing Tender - 146642932

Procurement Summary

Country: Germany

Summary: 200 Mm Wafer Prober Incl. Temperature Testing (Iis-05.1) - Pr1227015-2440-P

Deadline: 07 Sep 2026

Posting Date: 06 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146642932

Document Ref. No.: 543721-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38552000 - Electronic meters

Purchaser's Detail

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Tender Details

200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P
1 Piece 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) This specification describes the requirements for one wafer probing system to be used for characterization and test engineering for sensor ICs and chiplets at the Fraunhofer IIS. The system must allow handling of 200 mm and 300 mm wafers and 300 mm dicing frames. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetical sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to be made off non-magnetic metarials to prevent distortion while characterizing magnetic field sensors. Options: 4.2Wafer ChuckATT Dry Air control 4.9Wafer ChuckHigh Voltage Preparation 5.5LoadingOCR-Reader Top-Side 5.6LoadingWafer ID-Reading for text with standard and non-standard fonts, Barcode and QR-Code 9.1Electrical Interface and remote controlPossibility for remote control of the prober system 9.2Electrical Interface and remote controlInterface GPIB (IEEE-488)
Doc Title: 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P
Contract Type: supplies
Document Type: Contract Notice

Reference Number: PR1227015-2440-P

Contract Type: supplies

Authority Type: pub-undert

Doc Title: 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P

Dispatch Date: 2026-08-05

Publish Date: 2026-08-06

Submission Date: 2026-09-07

Documents

 Tender Notice