Procurement Summary
Country: Germany
Summary: 200 Mm Semi-Automatic Rf Probe System for On-Wafer Measurements up to 250 Ghz
Deadline: 24 Jul 2026
Posting Date: 25 Jun 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 143991387
Document Ref. No.: 432100-2026
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
CPV Classification
38341300 - Instruments for measuring electrical quantities
38540000 - Machines and apparatus for testing and measuring
Purchaser's Detail
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Tender Details
200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz 200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz - Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability - Precision Z stage: minimum travel range 30 mm, repeatability - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz Doc Title: 200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz Contract Type: supplies
Document Type: Contract Notice Reference Number: IHP-2026-033 Contract Type: supplies Authority Type: org-sub Doc Title: 200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz Dispatch Date: 2026-06-23 Publish Date: 2026-06-25 Submission Date: 2026-07-24
Documents
Tender Notice