Procurement Summary
Country : USA
Summary : Wirebonders
Deadline : 03 Nov 2022
Other Information
Notice Type : Tender
TOT Ref.No.: 73443419
Document Ref. No. : RFP325055sld
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Description
Wire bonder - automatic & manual
Wirebond from a circuit defined on a substrate to PCB board.
The substrate for the circuit will either be Si or Sapphire with typical size in millimeter to centimeter.
The circuit pads to bond could be Au, Al, Nb, or Ta with typical thickness of
100 to 200 nm.
Active Contract Opportunity
Notice ID : RFP325055sld
Related Notice
Department/Ind. Agency : ENERGY, DEPARTMENT OF
Sub-tier : ENERGY, DEPARTMENT OF
Office : FERMILAB - DOE CONTRACTOR
General Information
Contract Opportunity Type: Solicitation (Original)
All Dates/Times are: (UTC-05:00) CENTRAL STANDARD TIME, CHICAGO, USA
Original Published Date: Oct 19, 2022 09:40 am CDT
Original Date Offers Due: Nov 03, 2022 03:00 pm CDT
Inactive Policy: Manual
Original Inactive Date: Nov 04, 2022
Initiative: None
Classification
Original Set Aside:
Product Service Code: AJ13 - GENERAL SCIENCE & TECHNOLOGY R&D SVCS; GENERAL SCIENCE & TECHNOLOGY; ExPERIMENTAL DEVELOPMENT
NAICS Code: 423610 - Electrical Apparatus and Equipment, Wiring Supplies, and Related Equipment Merchant Wholesalers
Place of Performance: Batavia, IL 60510 USA
Documents
Tender Notice