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FOUNDATION ACT INCREASE BOOK TECHNO PARK has floated a tender for Wedge Wire Bonder. The project location is South Korea and the tender is closing on 28 Sep 2021. The tender notice number is 20210915318-00, while the TOT Ref Number is 57573583. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : South Korea
Summary : Wedge Wire Bonder
Deadline : 28 Sep 2021
Other Information
Notice Type : Tender
TOT Ref.No.: 57573583
Document Ref. No. : 20210915318-00
Competition : ICB
Financier : Self Financed
Purchaser Ownership : -
Tender Value : Refer Document
Purchaser's Detail
Purchaser : FOUNDATION ACT INCREASE BOOK TECHNO PARK
Korea
Name: Lee Geun Hee
Phone: 070-4056-7557
[Disclaimer: For more information on exact organizational / bidding agencies, see Bidding Notice.]
South Korea
Email :leeghe@korea.kr
Tender Details
Wedge Wire Bonder
Documents
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