Procurement Summary
Country : Japan
Summary : Wafer Silicon through Via Processing for Qubit Devices
Deadline : 22 Apr 2025
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Notice Type : Tender
TOT Ref.No.: 117372758
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Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
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Wafer silicon through-via processing for qubit devices
Description: Wafer silicon through-via processing for qubit devices
Return to list of services provision Procurement subject Wafer silicon through-via processing for qubit devices Procurement form announcement date Bid deadline date Opening date Procurement location General competitive bid 202...
Deadline: 2025-04-22
[Disclaimer: No specific deadline is specified for this notice, so 15 days have been added from the date of posting]
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Tender Notice