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Wafer Metrology Tender in Finland - 140222847

The TECHNOLOGY RESEARCH CENTER VTT OY has issued a Tender notice for the procurement of a Wafer Metrology in the Finland. This Tender notice was published on 27 Apr 2026 and is scheduled to close on 29 May 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 140222847, while the tender notice number is REF.NO. 11/206/2026 and Registering on the platform.

Procurement Summary

Country: Finland

Summary: Wafer Metrology

Deadline: 29 May 2026

Posting Date: 27 Apr 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 140222847

Document Ref. No.: REF.NO. 11/206/2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited.The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Published: 26/04/2026 Deadline for submitting questions: 11/05/2026 Deadline for tenders: 29/05/2026

Documents

Tender Notice

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