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Wafer Aligner and Bonder Tender in China - 110705779

The SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECH CHINESE ACADEMY OF SCIENCE has issued a Tender notice for the procurement of a Wafer Aligner and Bonder in the China. This Tender notice was published on 26 Nov 2024 and is scheduled to close on 17 Dec 2024, with an estimated Tender value of CNY 500. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 110705779, while the tender notice number is 0834-2441SH24A602 and Registering on the platform.

Procurement Summary

Country: China

Summary: Wafer Aligner and Bonder

Deadline: 17 Dec 2024

Posting Date: 26 Nov 2024

Other Information

Notice Type: Tender

TOT Ref.No.: 110705779

Document Ref. No.: 0834-2441SH24A602

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: CNY 500

Purchaser's Detail

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Tender Details

Wafer Aligner And Bonder
Place of Implementation:No.865, Changning Road, Shanghai
Deadline:2024-12-17

Documents

Tender Notice

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