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The ENERGY, DEPARTMENT OF has issued a Tender notice for the procurement of a technology licensing opportunity electroplated materials and array design for scintillators in the USA. This Tender notice was published on 22 Jan 2026 and is scheduled to close on 11 Feb 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 134141415, while the tender notice number is S-133996 and Registering on the platform.
Procurement Summary
Country: USA
Summary: technology licensing opportunity electroplated materials and array design for scintillators
Deadline: 11 Feb 2026
Posting Date: 22 Jan 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 134141415
Document Ref. No.: S-133996
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Modern scintillator grids are essential to radiation detection systems that require high spatial resolution and fast response. However, current grid fabrication methods rely on hazardous chemical etching and produce inconsistent structures that limit performance, scalability, and safety. This capability addresses the limitations of current fabrication methods by eliminating hazardous chemical etching, improving uniformity, and enabling complex geometries at scale.
Advantages
Enables high-resolution grid fabrication from high-Z metals (e.g., Re, Au, Re/Ni)
Avoids toxic and hazardous chemicals associated with traditional etching
Supports scalable production of precision-aligned, high-Z scintillator arrays with low material loss
Provides micron-level dimensional control and uniformity
Compatible with multiple scintillator materials and array configurations, enabling customization for medical, industrial, and defense applications
Adaptable to custom geometries for specialized imaging or detection applications
Technology Description
This technology enables the fabrication of dense, high-resolution scintillator grid arrays with micron-level precision, suitable for advanced radiation detection and imaging applications. The process works by electroplating high-Z metals, such as rhenium (Re), gold (Au), or their alloys, onto a substrate in the shape of the final grid geometry. These electro-formed components are then joined using hot isostatic pressing (HIP) at metal-specific temperatures and pressures to form solid bonded structures. Finally, the substrate is dissolved, leaving behind a free-standing, precision-aligned grid array. This approach eliminates chemical hazards, improves feature uniformity, and supports complex geometries, making it suitable for both small- and large-scale detector production.
Market Applications
This technology supports next-generation imaging and detection systems where high resolution, precision fabricati...
Notice ID: s-133996
Department/Ind. Agency: energy, department of
Sub-tier: energy, department of
Office: triad - doe contractor
Product Service Code: aj12 - general science and technology r&d services; general science and technology; applied research
NAICS Code: 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Inactive Dates: feb 11, 2027
Inactive Policy: manual
Documents
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