Supply, Delivery and Installation of Wafer-Level Tender - 146598996

Procurement Summary

Country: United Kingdom

Summary: Supply, Delivery and Installation of Wafer-Level Optical Tester

Deadline: 07 Sep 2026

Posting Date: 05 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146598996

Document Ref. No.: AUG561631

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: GBP 788000.00

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Supply, Delivery and Installation of Wafer-Level Optical Tester
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.DescriptionThe University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).
Reference number : UOS-43643-2026
Deadline : 2026-09-07

Documents

 Tender Notice