Supply, Delivery and Installation of Power Tender - 145531893

Procurement Summary

Country: United Kingdom

Summary: Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment

Deadline: 19 Aug 2026

Posting Date: 20 Jul 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 145531893

Document Ref. No.: JUL560497

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: GBP 1000000.00

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.DescriptionThis tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:(1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber.
Reference number : UOS-43845-2026
Deadline : 2026-08-19

Documents

 Tender Notice