Procurement Summary
Country: United Kingdom
Summary: Supply, Delivery and Installation of Optical Alignment & Packaging System
Deadline: 04 Sep 2026
Posting Date: 03 Aug 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 146467588
Document Ref. No.: AUG561427
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
CPV Classification
38000000 - Laboratory, optical and precision equipments (excl. glasses)
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Login to see detailsTender Details
Supply, Delivery and Installation of Optical Alignment & Packaging System
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.DescriptionThe University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
Reference number : UOS-43816-2026
Deadline : 2026-09-04
Documents
Tender Notice